View SST49LF002B-33-4C-NHE_6957346.PDF datasheet online --- IC-ON-LINE

Datasheet File OCR Text:

?2005 silicon storage technology, inc. s71232-05-000 1/05 1 the sst logo and superflash are registered trademarks of silicon storage technology, inc. intel is a registered trademark of intel corporation. these specifications are subject to change without notice. data sheet features: ? 2 mbit, 3 mbit, or 4 mbit superflash memory array for code/data storage ? sst49lf002b: 256k x8 (2 mbit) ? sst49lf003b: 384k x8 (3 mbit) ? sst49lf004b: 512k x8 (4 mbit) conforms to intel lpc interface specification 1.1 ? supports single-byte lpc memory and firmware memory cycle types flexible erase capability ? uniform 4 kbyte sectors ? uniform 16 kbyte overlay blocks for sst49lf002b ? uniform 64 kbyte overlay blocks for sst49lf003b/004b ? chip-erase for pp mode only single 3.0-3.6v read and write operations superior reliability ? endurance: 100,000 cycles (typical) ? greater than 100 years data retention low power consumption ? active read current: 6 ma (typical) ? standby current: 10 a (typical) fast sector-erase/byte-program operation ? sector-erase time: 18 ms (typical) ? block-erase time: 18 ms (typical) ? chip-erase time: 70 ms (typical) ? byte-program time: 14 s (typical) ? chip rewrite time: sst49lf002b: 4 seconds (typical) sst49lf003b: 6 seconds (typical) sst49lf004b: 8 seconds (typical) ? single-pulse program or erase ? internal timing generation two operational modes ? low pin count (lpc) interface mode for in-system operation ? parallel programming (pp) mode for fast production programming lpc interface mode ? lpc bus interface supporting byte read and write ? 33 mhz clock frequency operation ? wp# and tbl# pins provide hardware write protect for entire chip and/or top boot block ? block locking registers for individual block write-lock and lock-down protection ? jedec standard sdp command set ? data# polling and toggle bit for end-of-write detection ? 5 gpi pins for system design flexibility ? 4 id pins for multi-chip selection parallel programming (pp) mode ? 11-pin multiplexed address and 8-pin data i/o interface ? supports fast in-system or prom programming for manufacturing cmos and pci i/o compatibility packages available ? 32-lead plcc all devices for sst49lf004b only: ? 40-lead tsop (10mm x 20mm) all non-pb (lead-free) devices are rohs compliant product description the sst49lf00xb flash memory devices are designed to interface with host controllers (chipsets) that support a low- pin-count (lpc) interface for bios applications. the sst49lf00xb devices comply with intel?s lpc interface specification 1.1, supporting single-byte firmware memory and lpc memory cycle types. the sst49lf00xb devices are backward compatible to the sst49lf00xa firmware hub and the sst49lf0x0a lpc flash. in this document, fwh mode in the sst49lf00xa specification is referenced as the firmware memory read/write cycle and lpc mode in the sst49lf0x0a specification is referenced as the lpc memory read/write cycle. two interface modes are sup- ported by the sst49lf00xb: lpc mode (firmware mem- ory and lpc memory cycle ty pes) for in-system operations and parallel programming (pp) mode to interface with pro- gramming equipment. the sst49lf00xb flash memory devices are manufac- tured with sst?s proprietary, high-performance superflash technology. the split-gate cell design and thick-oxide tun- neling injector attain greater reliability and manufacturability compared with alternative approaches. the sst49lf00xb devices significantly improve performance and reliability, while lowering power consumption. the sst49lf00xb devices write (program or erase) with a single 3.0-3.6v power supply. 2 mbit / 3 mbit / 4 mbit lpc firmware flash sst49lf002b / sst49lf003b / sst49lf004b sst49lf002b / 003b / 004b2mb / 3mb / 4mb lpc firmware memory
2 data sheet 2 mbit / 3 mbit / 4 mbit lpc firmware flash sst49lf002b / sst49 lf003b / sst49lf004b ?2005 silicon storage technology, inc. s71232-05-000 1/05 the sst49lf00xb use less energy during erase and pro- gram than alternative flash memory technologies. the total energy consumed is a function of the applied voltage, cur- rent and time of application. since for any given voltage range the superflash technology uses less current to pro- gram and has a shorter erase time, the total energy con- sumed during any erase or program operation is less than alternative flash memory technologies. the superflash technology provides fixed erase and pro- gram times, independent of the number of erase/program cycles that have occurred. this means the system software or hardware does not have to be calibrated or correlated to the cumulative number of erase cycles as is necessary with alternative flash memory technologies, whose erase and program times increase with accumulated erase/pro- gram cycles. the sst49lf00xb devices provide a maximum byte-pro- gram time of 20 sec. the entire memory can be erased and programmed byte-by-byte typically in 8 seconds for the sst49lf004b device, when using status detection fea- tures such as toggle bit or data# polling to indicate the completion of program operation. to protect against inad- vertent writes, the sst49lf00xb device employ on-chip hardware and software data protection (sdp) schemes. it is offered with a typical endurance of 100,000 cycles. data retention is rated at greater than 100 years. to meet high density, surface mount requirements, the sst49lf00xb devices are offered in 32-lead plcc; addi- tionally the sst49lf004b is offered in a 40-lead tsop package. in addition, sst is providing lead-free (non-pb) package options to address the growing need for non-pb solutions in electronic components. non-pb package ver- sion can be obtained by ordering products with a package code suffix of ?e? as the environmental attribute in the prod- uct part number. see figures 1 and 2 for pin assignments and table 1 for pin descriptions. table of contents product description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 list of figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 list of tables. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 functional blocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 pin assignments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 pin descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 clock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 input/output communications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 input communication frame. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 interface mode select . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 reset. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 identification inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 general purpose inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 write protect / top block lock . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 row / column select . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 output enable . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 write enable . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 no connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 device memory maps . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 design considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
data sheet 2 mbit / 3 mbit / 4 mbit lpc firmware flash sst49lf002b / sst49lf003b / sst49lf004b 3 ?2005 silicon storage technology, inc. s71232-05-000 1/05 product identification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 mode selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 lpc mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 device operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 firmware memory read cycle . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 firmware memory write cycle . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 lpc memory read cycle . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 lpc memory write cycle . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 abort mechanism . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 response to invalid fields for firmware memory cycle. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 response to invalid fields for lpc memory cycle. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 multiple device selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 write operation status detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 registers. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 parallel programming mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 device operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 write operation status detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 data protection (pp mode) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 software command sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 dc characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 ac characteristics (lpc mode) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 ac characteristics (pp mode) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 product ordering information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40 packaging diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
4 data sheet 2 mbit / 3 mbit / 4 mbit lpc firmware flash sst49lf002b / sst49 lf003b / sst49lf004b ?2005 silicon storage technology, inc. s71232-05-000 1/05 list of figures figure 1: pin assignments for 32-lead plcc . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 figure 2: pin assignments for 40-lead tsop (10mm x 20mm) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 figure 3: device memory map for sst49lf002b . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 0 figure 4: device memory map for sst49lf003b . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1 figure 5: device memory map for sst49lf004b . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1 figure 6: firmware memory read cycle waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 figure 7: firmware memory write cycle waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 5 figure 8: lpc memory read cycle waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 figure 9: lpc memory write cycle waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 figure 10: lclk waveform (lpc mode) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 figure 11: output timing parameters (lpc mode) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 figure 12: input timing parameters (lpc mode) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 figure 13: reset timing diagram (lpc mode) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 figure 14: reset timing diagram (pp mode) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 figure 15: read cycle timing diagram (pp mode) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 figure 16: write cycle timing diagram (pp mode) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34 figure 17: data# polling timing dia gram (pp mode) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 figure 18: toggle bit timing diagram (pp mode) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35 figure 19: byte-program timing diagram (pp mode) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36 figure 20: sector-erase timing diagram (pp mode) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6 figure 21: block-erase timing diagram (pp mode) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 figure 22: chip-erase timing diagram (pp mode) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37 figure 23: software id entry and read (pp mode) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 figure 24: software id exit (pp mode) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38 figure 25: ac input/output reference waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39 figure 26: a test load example. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
data sheet 2 mbit / 3 mbit / 4 mbit lpc firmware flash sst49lf002b / sst49lf003b / sst49lf004b 5 ?2005 silicon storage technology, inc. s71232-05-000 1/05 list of tables table 1: pin description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 table 2: most significant addresses . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 table 3: product identification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 table 4: firmware and lpc memory cycles start field definition . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 table 5: firmware memory read cycle field definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 table 6: firmware memory write cycle. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 table 7: lpc memory read cycle field definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 table 8: lpc memory write cycle field definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 table 9: lpc memory address decoding range for sst49lf002b . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 table 10: lpc memory address decoding range for sst49lf003b and sst49lf004b. . . . . . . . . . . 19 table 11: sst49lf002b lpc memory address bits definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 table 12: sst49lf003b and sst49lf004b lpc memory address bits definition . . . . . . . . . . . . . . . . 19 table 13: firmware memory multiple device selection configuration . . . . . . . . . . . . . . . . . . . . . . . . . . 20 table 14: lpc memory multiple device selection configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 table 15: block locking registers for sst49lf002b. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 table 16: block locking registers for sst49lf003b/004b . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 table 17: block locking register bits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 table 18: operation modes selection (pp mode) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 table 19: software command sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 table 20: dc operating characteristics (all interfaces) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 table 21: recommended system power-up timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 table 22: pin capacitance. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 table 23: reliability characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 table 24: clock timing parameters (lpc mode) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 table 25: read/write cycle timing parameters (lpc mode) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 table 26: ac input/output specifications (lpc mode) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 9 table 27: interface measurement condition parameters (lpc mode) . . . . . . . . . . . . . . . . . . . . . . . . . . 31 table 28: reset timing parameters (lpc mode) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 table 29: reset timing parameters (pp mode) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 table 30: read cycle timing parameters (pp mode). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 table 31: program/erase cycle timing parameters (pp mode) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 table 32: revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 43
6 data sheet 2 mbit / 3 mbit / 4 mbit lpc firmware flash sst49lf002b / sst49 lf003b / sst49lf004b ?2005 silicon storage technology, inc. s71232-05-000 1/05 functional blocks 1232 ill b1 .0 y-decoder i/o buffers and data latches address buffers & latches x-decoder superflash memory control logic lclk rst# mode gpi[4:0] programmer interface wp# tbl# init# id[3:0] l frame# r/c# oe# we# a[10:0] dq[7:0] lad[3:0] fwh/lpc interface f unctional b lock d iagram
data sheet 2 mbit / 3 mbit / 4 mbit lpc firmware flash sst49lf002b / sst49lf003b / sst49lf004b 7 ?2005 silicon storage technology, inc. s71232-05-000 1/05 pin assignments figure 1: p in a ssignments for 32- lead plcc figure 2: p in a ssignments for 40- lead tsop (10 mm x 20 mm ) 5 6 7 8 9 10 11 12 13 29 28 27 26 25 24 23 22 21 a7(gpi1) a6 (gpi0) a5 (wp#) a4 (tbl#) a3 (id3) a2 (id2) a1 (id1) a0 (id0) d q0 (lad0) mode (mode) v ss (v ss ) nc nc v dd (v dd ) oe# (init#) we# (lframe# ) nc dq7 (res) 4 3 2 1 32 31 30 a8 (gpi2) a9 (gpi3) rst# (rst #) nc v dd (v dd ) r/c# (lclk ) a10 (gpi4) 32-lead plcc top view 1232 32-plcc p1 .0 14 15 16 17 18 19 20 dq1 (lad1) dq2 (lad2) v ss (v ss ) dq3 (lad3) dq4 (res) dq5 (res) dq6 (res) ( ) designates lpc mode 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 40 39 38 37 36 35 34 33 32 31 30 29 28 27 26 25 24 23 22 21 1232 40-tsop p2.0 standard pinout top view die up nc (nc) m ode (mode) nc (nc) nc (nc) nc (nc) nc (nc) a10 (gpi4) nc (nc) r/c# (lclk) v dd nc (nc) rst# (rst#) nc (nc) nc (nc) a9 (gpi3) a8 (gpi2) a7 (gpi1) a6 (gpi0) a5 (wp#) a4 (tbl#) v ss v dd (lframe#) we # (init#) oe# (nc) nc (res) dq7 (res) dq6 (res) dq5 (res) dq4 (nc) nc v ss v ss (lad3) dq3 (lad2) dq2 (lad1) dq1 (lad0) dq0 (id0) a0 (id1) a1 (id2) a2 (id3) a3 ( ) designates lpc mode
8 data sheet 2 mbit / 3 mbit / 4 mbit lpc firmware flash sst49lf002b / sst49 lf003b / sst49lf004b ?2005 silicon storage technology, inc. s71232-05-000 1/05 pin descriptions table 1: p in d escription symbol pin name type 1 1. i = input, o = output interface functions pp lpc lclk clock i x to provide a clock input to the control unit. the clock conforms to the pci specification. lad[3:0] address and data i/o x to provide lpc bus information such as addresses and command inputs/outputs to memory. lframe# frame i x to indicate start of a data transfer operat ion; also used to abort an lpc cycle in progress. mode interface mode select ixx this pin determines which interface is operational. when held high, programmer mode is enabled and when held low, lpc mode is enabled. this pin must be set at power-up or before returning from reset and must not change during device opera- tion. this pin must be held high (v ih ) for pp mode and low (v il ) for lpc mode. this pin is internally pulled-down with a resistor between 20-100 k ?. rst# reset i x x to reset the operation of the device init# initialize i x this is the second reset pin for in-system use. this pin functions id entically to rst#. id[3:0] identification inputs ix these four pins are part of the mechanism that allows multiple parts to be attached to the same bus. the strapping of these pi ns is used to identify the component. the boot device must have id[3:0]=0000, al l subsequent devices should use sequential count-up strapping. these pins are intern ally pulled-down with a resistor between 20-100 k ?. gpi[4:0] general purpose inputs ix these individual inputs can be used for additional board flexibility. the state of these pins can be read through gpi_reg (general purpose inputs register). these inputs should be at their desired state before the start of the lpc clock cycle during which the read is attempted, and should remain in place until the end of the read cycle. unused gpi pins must not be floated. tbl# top block lock i x when low, prevents programming to the boot block sectors at the top of the device memory. when tbl# is high it disables har dware write protection for the top block sectors. this pin cannot be left unconnected. wp# write protect i x when low, prevents programming to all but the highest addressable blocks. when wp# is high it disables hardware write prot ection for these blocks. this pin cannot be left unconnected. r/c# row/column select ix select for the programming interface, this pin determines whether the address pins are pointing to the row addresses, or to the column addresses. a 10 -a 0 address i x inputs for low-order addresses during re ad and write operations. addresses are internally latched during a write cycle. for the programming interface, these addresses are latched by r/c# and share the same pins as the high-order address inputs. dq 7 -dq 0 data i/o x to output data during read cycles and receive input data during write cycles. data is internally latched during a write cycle. the outputs are in tri-state when oe# is high. oe# output enable i x to gate the data output buffers. we# write enable i x to control the write operations. res reserved x these pins must be left unconnected. v dd power supply pwr x x to provide power supply (3.0-3.6v) v ss ground pwr x x circuit ground (0v reference) nc no connection n/a n/a unconnected pins. t1.2 1232
data sheet 2 mbit / 3 mbit / 4 mbit lpc firmware flash sst49lf002b / sst49lf003b / sst49lf004b 9 ?2005 silicon storage technology, inc. s71232-05-000 1/05 clock the lclk pin accepts a clock input from the host controller. input/output communications the lad[3:0] pins are used to serially communicate cycle information such as cycle type, cycle direction, id selection, address, data, and sync fields. input communication frame the lframe# pin is used to indicate start of a lpc bus cycle. the pin is also used to abort an lpc bus cycle in progress. interface mode select the mode pin is used to set the interface mode. if the mode pin is set to logic high, the device is in pp mode. if the mode pin is set low, the device is in the lpc mode. the mode selection pin must be configured prior to device oper- ation. the mode pin is internally pulled down if the pin is left unconnected. reset a v il on init# or rst# pin initiates a device reset. init# and rst# pins have the same function internally. it is required to drive init# or rst# pins low during a system reset to ensure proper cpu initialization. during a read operation, driving init# or rst# pins low deselects the device and places the output drivers, lad[3:0], in a high impedance state. the reset signal must be held low for a minimum of time t rstp . a reset latency occurs if a reset pro- cedure is performed during a program or erase operation. see table 28 and table 29, reset timing parameters, for more information. a device reset during an active program or erase operation will abort the operation and memory contents may become invalid due to data being altered or corrupted from an incomplete erase or program operation. identification inputs these pins are part of a mechanism that allows multiple devices to be attached to the same bus. the strapping of these pins is used to identify the component. the boot device must have id[3:0] = 0; all subsequent devices should use sequential count-up strapping. these pins are internally pulled-down with a resistor between 20-100 k ? . general purpose inputs the general purpose inputs (gpi[4:0]) can be used as dig- ital inputs for the cpu to read. the gpi register holds the values on these pins. the da ta on the gpi pins must be stable before the start of a gpi register read and remain stable until the read cycle is complete. the pins must be driven low, v il , or high, v ih but not left unconnected (float). write protect / top block lock the top boot lock (tbl#) and write protect (wp#) pins are provided for hardware write protection of device mem- ory in the sst49lf00xb. the tbl# pin is used to write pro- tect 16 boot sectors (64 kbyte) at the highest memory address range for the sst49lf003b/004b and 4 boot sec- tors (16 kbyte) for the sst49lf002b. the wp# pin write protects the remaining sectors in the flash memory. an active low signal at the tbl# pin prevents program and erase operations of the top boot block. when tbl# pin is held high, the hardware write protection of the top boot block is disabled. the wp# pin serves the same function for the remaining blocks of the device memory. the tbl# and wp# pins write protection functions operate independently of one another. both tbl# and wp# pins must be set to their required protection states prior to starting a program or erase operation. a logic level change occurring at the tbl# or wp# pin during a program or erase operation could cause unpredictable results. row / column select the r/c# pin is used to control the multiplex address inputs in parallel programming (pp) mode. the column addresses are mapped to the higher internal addresses (a ms-11 ) shown in table 2, and the row addresses are mapped to the lower internal addresses (a 10-0 ). output enable the oe# pin is used to gate the output data buffers in pp mode. write enable the we# pin is used to control the write operations in pp mode. no connection these pins are not connected internally. table 2: m ost s ignificant a ddresses a ms device a 17 sst49lf002b a 18 sst49lf003b / sst49lf004b t2.0 1232
10 data sheet 2 mbit / 3 mbit / 4 mbit lpc firmware flash sst49lf002b / sst49 lf003b / sst49lf004b ?2005 silicon storage technology, inc. s71232-05-000 1/05 device memory maps figure 3: d evice m emory m ap for sst49lf002b 3ffffh 3c000h 3bfffh 38000h 37fffh 34000h 33fffh 30000h 2ffffh 2c000h 2bfffh 28000h 27fffh 24000h 23fffh 20000h 1ffffh 1c000h 1bfffh 18000h 17fffh 14000h 13fffh 10000h 0ffffh 0c000h 0bfffh 08000h 07fffh 04000h 03fffh 300000 02fffh 02000h 01fffh 01000h 00fffh 00000h block 7 block 8 block 6 block 5 block 4 block 3 block 2 block 1 block 15 block 14 block 13 block 12 block 11 block 10 block 9 block 0 (16 kbyte) 1232 f24.0 wp# for b lock 0-14 tbl# 4 kbyte sector 1 4 kbyte sector 2 4 kbyte sector 3 4 kbyte sector 0 boot block
data sheet 2 mbit / 3 mbit / 4 mbit lpc firmware flash sst49lf002b / sst49lf003b / sst49lf004b 11 ?2005 silicon storage technology, inc. s71232-05-000 1/05 figure 4: d evice m emory m ap for sst49lf003b figure 5: d evice m emory m ap for sst49lf004b 7ffffh 70000h 6ffffh 60000h 5ffffh 50000h 4ffffh 40000h 3ffffh 30000h 2f000h 22000h 21000h 20000h 1ffffh 10000h 0ffffh 00000h block 7 block 6 block 5 block 4 block 3 block 2 *block 1 4 kbyte sector 33 4 kbyte sector 34 4 kbyte sector 32 invalid range invalid range 4 kbyte sector 47 *block 0 1232 f25. 0 (64 kbyte) boot block * operations to shaded area are not valid. w p# for b lock 2-6 tbl# 7ffffh 70000h 6ffffh 60000h 5ffffh 50000h 4ffffh 40000h 3ffffh 30000h 2ffffh 20000h 1ffffh 10000h 0f000h 02000h 01000h 00000h boot block 4 kbyte sector 1 4 kbyte sector 2 4 kbyte sector 0 block 7 block 6 block 5 block 4 block 3 block 2 block 1 block 0 1232 f02.0 wp# b lock 0-6 tbl# (64 kbyte)
12 data sheet 2 mbit / 3 mbit / 4 mbit lpc firmware flash sst49lf002b / sst49 lf003b / sst49lf004b ?2005 silicon storage technology, inc. s71232-05-000 1/05 design considerations sst recommends a high frequency 0.1 f ceramic capac- itor to be placed as close as possible between v dd and v ss less than 1 cm away from the v dd pin of the device. additionally, a low frequency 4.7 f electrolytic capacitor from v dd to v ss should be placed within 1 cm of the v dd pin. if a socket is used for programming purposes, an addi- tional 1-10 f should be added next to each socket. the rst# and init# pins must remain stable at v ih for the entire duration of an erase or program operation. wp# must remain stable at v ih for the entire duration of the erase and program operations for non-boot block sectors. to write data to the top boot block sectors, the tbl# pin must also remain stable at v ih for the entire duration of the erase and program operations. product identification the product identification mode identifies the device as the sst49lf00xb and manufacturer as sst. mode selection the sst49lf00xb flash memory device operates in two distinct interface modes: the lpc mode and the parallel programming (pp) mode. the mode (interface mode select) pin is used to set the interface mode selection. if the mode pin is set to logic high, the device is in pp mode; while if the mode pin is set low, the device is in lpc mode. the mode selection pin must be configured prior to device operation and must not change during operation. if the pin is not connected, by default the mode pin is internally pulled low and the 49lf00xb will be in lpc operation. in lpc mode, communication between the host and the sst49lf00xb occurs via the 4- bit i/o communication sig- nals, lad[3:0] and lframe#. the sst49lf00xb detects whether it is being accessed via a fwh or lpc protocol by detecting the start field contents; a 1101b or 1110b indi- cates a firmware memory cycle and a 0000b indicates an lpc memory cycle. in pp mode, the device is controlled via the 11 addresses, a 10 -a 0 , and 8 i/o, dq 7 -dq 0 , signals. the address inputs are multiplexed in row and column selected by control sig- nal r/c# pin. the row addresses are mapped to the lower internal addresses (a 10-0 ), and the column addresses are mapped to the higher internal addresses (a ms-11 ) shown in table 2. see figures 3 through 5, device memory maps, for address assignments. table 3: p roduct i dentification address data pp mode lpc mode 1 1. address shown in this column is for boot device only. address locations should appear elsewhere in the 4 gbyte system memory map depending on id strapping values on id[3:0] pins when multiple lpc memory devices are used in a system. manufacturer?s id 0000h ffbc 0000h bfh device id 2 2. the device id for sst49lf00xb is the same as sst49lf00xa. sst49lf002b 0001h ffbc 0001h 57h sst49lf003b 0001h ffbc 0001h 1bh sst49lf004b 0001h ffbc 0001h 60h t3.1 1232
data sheet 2 mbit / 3 mbit / 4 mbit lpc firmware flash sst49lf002b / sst49lf003b / sst49lf004b 13 ?2005 silicon storage technology, inc. s71232-05-000 1/05 lpc mode device operation the lpc mode uses a 5-signal communication interface consisting of one control line, lframe#, which is driven by the host to start or abort a bus cycle, and a 4-bit data bus, lad[3:0], which is used to communicate cycle type, cycle direction, id selection, addres s, data and sync fields. the device enters standby mode when lframe# is high and no internal operation is in progress. the sst49lf00xb supports both single-byte firmware memory read/write cycles and single-byte lpc memory read/write cycles as defined in intel?s low-pin-count interface specification, revision 1.1. the host drives lframe# low for one or more clock cycles to initiate an lpc cycle. the last latched value of lad[3:0] before lframe# is the start value. the start value deter- mines whether the sst49lf00xb will respond to a firm- ware memory read/write cycle or a lpc memory read/ write cycle as defined in table 4. see following sections for details of firmware memory and lpc memory cycle types. jedec standard sdp (soft- ware data protection) program and erase command sequences are used to initiate firmware and lpc memory program and erase operations. see table 18 for a listing of program and erase commands. chip-erase is only available in pp mode. table 4: f irmware and lpc m emory c ycles start f ield d efinition start value definition 0000 start of an lpc memo ry cycle. the direction (read or write) is determined by the second field of the lpc cycle. 1101 start of a firmware memory read cycle 1110 start of a firmware memory write cycle t4.0 1232
14 data sheet 2 mbit / 3 mbit / 4 mbit lpc firmware flash sst49lf002b / sst49 lf003b / sst49lf004b ?2005 silicon storage technology, inc. s71232-05-000 1/05 firmware memory read cycle figure 6: f irmware m emory r ead c ycle w aveform table 5: f irmware m emory r ead c ycle f ield d efinitions clock cycle field name field contents lad[3:0] 1 1. field contents are valid on the ri sing edge of the present clock cycle. lad[3:0] direction comments 1 start 1101 in lframe# must be active (low) for the device to respond. only the last field latched before lframe# transitions high will be recognized. the start field contents (1101b) indi- cate a firmware memory read cycle. 2 idsel 0000 to 1111 in indicates which sst 49lf00xb device should respond. if the idsel (id select) field matches the value of id[3:0], the device will respond to the lpc bus cycle. 3-9 maddr yyyy in these seven clock cyc les make up the 28-bit memory address. yyyy is one nibble of the entire address. addresses are transferred most-significant nibble first. 10 msize 0000 (1 byte) in the msize field indicates how many bytes will be trans- ferred during multi-byte operations. the sst49lf00xb only supports single-byte operation. msize=0000b 11 tar0 1111 in then float in this clock cycle, the master has driven the bus to all ?1?s and then floats the bus, prior to the next clock cycle. this is the first part of the bus ?turnaround cycle.? 12 tar1 1111 (float) float then out the sst49lf00xb takes control of the bus during this cycle. 13 rsync 0000 (ready) out during this clock cycle, the device generates a ?ready sync? (rsync) indicating that the device has received the input data. 14 data zzzz out zzzz is the least-significant nibble of the data byte. 15 data zzzz out zzzz is the most-significant nibble of the data byte. 16 tar0 1111 out then float in this clock cycle, the sst49lf00xb drives the bus to all ones and then floats the bus prior to the next clock cycle. this is the first part of the bus ?turnaround cycle.? 17 tar1 1111 (float) float then in the host resumes co ntrol of the bus during this cycle. t5.1 1232 1232 f03.0 l frame# lad[3:0] 1101b 0000b a[23:20] a[19:16] a[3:0] a[7:4] a[11:8] a[15:12] maddr start idsel msize lclk a[27:24] 0000b rsync tar1 tar0 ta r d[7:4] tri-state d[3:0] 0000b 1111b data
data sheet 2 mbit / 3 mbit / 4 mbit lpc firmware flash sst49lf002b / sst49lf003b / sst49lf004b 15 ?2005 silicon storage technology, inc. s71232-05-000 1/05 firmware memory write cycle figure 7: f irmware m emory w rite c ycle w aveform table 6: f irmware m emory w rite c ycle clock cycle field name field contents lad[3:0] 1 1. field contents are valid on the ri sing edge of the present clock cycle. lad[3:0] direction comments 1 start 1110 in lframe# must be active (low) for the device to respond. only the last field latched before lframe# transitions high will be recognized. the start field contents (1110b) indicate a firmware memory write cycle. 2 idsel 0000 to 1111 in indicates which sst49lf00xb device should respond. if the idsel (id select) field matches the value of id[3:0], the device will respond to the mem- ory cycle. 3-9 maddr yyyy in these seven clock cycles make up the 28-bit memory address. yyyy is one nibble of the entire address. addresses are transferred most-significant nibble first. 10 msize 0000 (1 byte) in the msize field indicates how many bytes will be transferred during multi-byte operations. the device only supports single-byte writes. msize=0000b 11 data zzzz in zzzz is the least-sign ificant nibble of the data byte. 12 data zzzz in zzzz is the most-significant nibble of the data byte. 13 tar0 1111 in then float in this clock cycle, the host drives the bus to all '1's and then floats the bus prior to the next clock cycle. this is the first part of the bus ?turnaround cycle.? 14 tar1 1111 (float) float then out the sst49lf 00xb takes control of the bus during this cycle. 15 rsync 0000 out during this clock cycle, the device generates a ?ready sync? (rsync) indicating that the device has received the input data. 16 tar0 1111 out then float in this clock cycle, the sst49lf00xb drives the bus to all '1's and then floats the bus prior to the next clock cycle. this is the first part of the bus ?turnaround cycle.? 17 tar1 1111 (float) float then in the host resumes control of the bus during this cycle. t6.0 1232 1232 f04.0 l frame# lad[3:0] 1110b 0000b a[23:20] a[19:16] a[3:0] a[7:4] a[11:8] a[15:12] maddr start idsel msize lclk a[27:24] 0000b rsync tar1 tar0 ta r data d[7:4] tri-state d[3:0] 0000b 1111b
16 data sheet 2 mbit / 3 mbit / 4 mbit lpc firmware flash sst49lf002b / sst49 lf003b / sst49lf004b ?2005 silicon storage technology, inc. s71232-05-000 1/05 lpc memory read cycle figure 8: lpc m emory r ead c ycle w aveform table 7: lpc m emory r ead c ycle f ield d efinitions clock cycle field name field contents lad[3:0] 1 1. field contents are valid on the ri sing edge of the present clock cycle. lad[3:0] direction comments 1 start 0000 in lframe# must be active (low) for the device to respond. only the last field latched before lframe# transitions high will be recognized. the start field contents (0000b) indicate an lpc memory cycle. 2 cyctype + dir 010x in indicates the type of lpc memory cycle. bits 3:2 must be ?01b? for memory cycle. bit 1 indicates the type of transfer ?0? for read. bit 0 is reserved. 3-10 addr yyyy in address phase for memory cycle. lpc protocol supports a 32- bit address phase. yyyy is one nibb le of the entire address. addresses are transferred most-significant nibble first. 11 tar0 1111 in then float in this clock cycle, the host drives the bus to all 1s and then floats the bus. this is the first part of the bus ?turnaround cycle.? 12 tar1 1111 (float) float then out the sst49lf00xb takes control of the bus during this cycle. 13 sync 0000 out the sst49lf00xb outputs the value 0000b indicating that it has received data. 14 data zzzz out zzzz is the least-significant nibble of the data byte. 15 data zzzz out zzzz is the most-signi ficant nibble of the data byte. 16 tar0 1111 in then float in this clock cycle, the host drives the bus to all 1s and then floats the bus. this is the first part of the bus ?turnaround cycle.? 17 tar1 1111 (float) float then out the sst49lf00xb takes control of the bus during this cycle. t7.0 1232 1232 f05.1 lclk l frame# lad[3:0] 0000b 010xb a[23:20] a[19:16] a[3:0] a[7:4] a[11:8] a[15:12] 1111b tri-state 2 clocks tar0 load address in 8 clocks address 1 clock 1 clock start cyctype + dir ta r 1 clock sync data data out 2 clocks 0000b d[7:4] d[3:0] a[31:28] a[27:24] ta r 1
data sheet 2 mbit / 3 mbit / 4 mbit lpc firmware flash sst49lf002b / sst49lf003b / sst49lf004b 17 ?2005 silicon storage technology, inc. s71232-05-000 1/05 lpc memory write cycle figure 9: lpc m emory w rite c ycle w aveform table 8: lpc m emory w rite c ycle f ield d efinitions clock cycle field name field contents lad[3:0] 1 1. field contents are valid on the ri sing edge of the present clock cycle. lad[3:0] direction comments 1 start 0000 in lframe# must be active (low) for the device to respond. only the last field latched before lframe# transitions high will be recognized. the start field contents (0000b) indica te an lpc memory cycle. 2 cyctype + dir 011x in indicates the type of lpc memory cycle. bits 3:2 must be ?01b? for memory cycle. bit 1 indicates the type of transfer ?1? for write. bit 0 is reserved. 3-10 addr yyyy in address phase for memory cycle. lpc protocol sup- ports a 32-bit address phase. yyyy is one nibble of the entire address. addresses are transferred most significant nibble first. 11 data zzzz in zzzz is the least-sign ificant nibble of the data byte. 12 data zzzz in zzzz is the most-significant nibble of the data byte. 13 tar0 1111 in in this clock cycle, the host drives the bus to all '1's and then floats the bus. this is the first part of the bus ?turn- around cycle.? 14 tar1 1111 (float) float then out the sst49lf 00xb takes control of the bus during this cycle. 15 sync 0000 out the sst49lf00xb outputs the values 0000, indicating that it has received data or a flash command. 16 tar0 1111 out then float in this clock cycle, the sst49lf00xb drives the bus to all '1's and then floats the bus. this is the first part of the bus ?turnaround cycle.? 17 tar1 1111 (float) float then in host resumes control of the bus during this cycle. t8.0 1232 1232 f06.1 l frame# lad[3:0] 0000b 011xb a[23:20] a[19:16] a[3:0] a[7:4] a[11:8] a[15:12] 1111b tri-state 2 clocks tar0 load address in 8 clocks address 1 clock 1 clock start cyctype + dir ta r 1 clock sync data load data in 2 clocks 0000b d[7:4] d[3:0] lclk a[31:28] a[27:24] data tar1
18 data sheet 2 mbit / 3 mbit / 4 mbit lpc firmware flash sst49lf002b / sst49 lf003b / sst49lf004b ?2005 silicon storage technology, inc. s71232-05-000 1/05 abort mechanism if lframe# is driven low for one or more clock cycles after the start of a bus cycle, the cycle will be terminated. the host may drive lad[3:0] with '1111b' (abort nibble) to return the interface to ready mode. the abort only affects the current bus cycle. for a multi-cycle command sequence, such as the erase or program sdp commands, abort doesn't interrupt the entire command sequence, only the current bus cycle of the command sequence. the host can re-send the bus cycle for the aborted command and continue the sdp command sequence after the device is ready again. response to invalid fi elds for firmware memory cycle during lpc operations the sst49lf00xb will not explicitly indicate that it has received invalid field sequences. the response to specific invalid fields or sequences is as fol- lows: id mismatch: if the idsel field does not match id[3:0], the device will ignore the cycle. see multiple device selec- tion section for details. address out of range: the address sequence is 7 fields long (28 bits) for firmware memory bus cycles, but only a 22 and a ms :a 0 will be decoded by sst49lf00xb. address a 22 has the special function of directing reads and writes to the flash core (a 22 =1) or to the register space (a 22 =0). the sst49lf00xb features are equivalent the only differ- ence being addressable memory space. for example, the sst49lf003b has 128 kbyte less memory and the sst49lf002b has 256 kbyte less than the sst49lf004b. for the sst49lf003b operations beyond the 3 mbit boundary (below 20000h) will return ffh for read operations and will ig nore write operations. invalid msize field if the device receives an invalid msize field during a firmware memory read or write cycle, the cycle will be i gnored and no operation will be attempted. the sst49lf00xb w ill not generate any kind of response in this situation. invalid size fields for a firmware memory cycle are any data other than 0000b. once valid start, idsel, and msize fields are received, the sst49lf00xb will always complete the bus cycle. however, if the device is busy performing a flash erase or program operation, no new write command (memory write or register write) will be executed. response to invalid fields for lpc memory cycle id mismatch: id information is included in the address bits of every lpc memory cycle, see tables 11 and 12. the sst49lf00xb will compare the id bits in the address field with id[3:0]. if the id bits in the address do not correspond to the hardware id pins the device will ignore the cycle. see multiple device selection section for details. address out of range : the address sequence is 8 fields long (32 bits). address a 22 has the special function of directing reads and writes to the flash core (a 22 =1) or to the register space (a 22 =0). the sst49lf00xb will only respond to address range specified in tables 9 and 10. once valid start, cyctype + dir, and address range (including id bits) are received, the sst49lf00xb will always complete the bus cycle. however, if the device is busy performing a flash erase or program operation, no new internal write command (memory write or register write) will be executed. as long as the states of lad[3:0] and lframe# are known, the response of the sst49lf00xb to signals received during the lpc cycle should be predictable.
data sheet 2 mbit / 3 mbit / 4 mbit lpc firmware flash sst49lf002b / sst49lf003b / sst49lf004b 19 ?2005 silicon storage technology, inc. s71232-05-000 1/05 table 9: lpc m emory a ddress d ecoding r ange for sst49lf002b id strapping device access address range memory size device #0 - 15 memory access ffff ffffh : ffc0 0000h 4 mbyte register access ffbf ff ffh : ff80 0000h 4 mbyte device #0 1 memory access 000f ffffh : 000e 0000h 128 kbyte t9.1 1232 1. for device #0 (boot device), sst49lf002b decodes the physical addr esses of the top 8 blocks (including boot block) both at sy s- tem memory ranges ffff ffffh to fffe 0000h and 000f ffffh to 000e 0000h. table 10: lpc m emory a ddress d ecoding r ange for sst49lf003b 1 and sst49lf004b 1. for the sst49lf003b, operations beyond the 3 mbit boundary (below 20000h) are not valid (see device memory map). id strapping device access address range memory size device #0 - 7 memory access ffff ffffh : ffc0 0000h 4 mbyte register access ffbf ff ffh : ff80 0000h 4 mbyte device #8 - 15 memory access ff7f ffffh : ff40 0000h 4 mbyte register access ff3f ffffh : ff00 0000h 4 mbyte device #0 2 2. for device #0 (boot device), sst49lf003b/004b decodes the physic al addresses of the top 2 blocks (including boot block) both at system memory ranges ffff ffffh to fffe 0000h and 000f ffffh to 000e 0000h. memory access 000f ffffh : 000e 0000h 128 kbyte t10.0 1232 table 11: sst49lf002b lpc m emory a ddress bits definition a 31 : a 23 1 1. for sst49lf002b, the top 8 mbyte address range ffff ffffh to ff80 0000h and the bottom 128 kbyte memory access address 000f ffffh to 000e 0000h are decoded. a 22 a 21 : a 18 a 17 :a 0 1111 1111b or 0000 0000b 1 = memory access 0 = register access id[3:0] 2 2. see table 14 for multiple device selection configuration. device memory address t11.0 1232 table 12: sst49lf003b 1 and sst49lf004b lpc m emory a ddress bits definition 1. for the sst49lf003b, operations beyond the 3 mbit boundary (below 20000h) are not valid (see device memory map). a 31 : a 24 2 2. for sst49lf003b/004b, the top 16 mbyte address range ffff ffffh to ff00 0000h and the bottom 128 kbyte memory access address 000f ffffh to 000e 0000h are decoded. a 23 a 22 a 21 : a 19 a 18 :a 0 1111 1111b or 0000 0000b id[3] 3 3. see table 14 for multiple device selection configuration. 1 = memory access 0 = register access id[2:0] 3 device memory address t12.0 1232
20 data sheet 2 mbit / 3 mbit / 4 mbit lpc firmware flash sst49lf002b / sst49 lf003b / sst49lf004b ?2005 silicon storage technology, inc. s71232-05-000 1/05 multiple device selection multiple lpc flash devices may be strapped to increase memory densities in a system. the four id pins, id[3:0], allow up to 16 devices to be attached to the same bus by using different id strapping in a system. bios support, bus loading, or the attaching bridge may limit this number. the boot device must have an id of 0000b (determined by id[3:0]); subsequent devices use incremental numbering. equal density must be used with multiple devices. multiple device selection for firmware memory cycle for firmware memory read/write cycles, hardware strap- ping values on id[3:0] must match the values in idsel field. see table 13 for multiple device selection configura- tions. the sst49lf00xb will compare the idsel field with id[3:0]'s strapping values. if there is a mismatch, the device will ignore the reminder of the cycle. multiple device selection for lpc memory cycle for lpc memory read/write cycles, id information is included in the address bits of every cycle. the id bits in the address field are the inverse of the hardware strapping. see table 14 for multiple device selection configurations. the sst49lf00xb will compare t hese bits with id[3:0]?s strapping values. if there is a mismatch, the device will ignore the remainder of the cycle. write operation status detection the sst49lf00xb device provides two software means to detect the completion of a write (program or erase) cycle, in order to optimize the system write cycle time. the soft- ware detection includes two status bits: data# polling, d[7], and toggle bit, d[6]. the end-of-write detection mode is incorporated into the firmware memory and lpc memory read cycles. the actual completion of the nonvolatile write is asynchronous with the system. therefore, either a data# polling or toggle bit read may be simultaneous with the completion of the write cycle. if this occurs, the system may possibly get an erroneous result, i.e., valid data may appear to conflict with either d[7] or d[6]. in order to prevent spurious rejection, if an erroneous result occurs, the soft- ware routine should include a loop to read the accessed location an additional two (2) times. if both reads are valid, then the device has completed the write cycle, otherwise the rejection is valid. table 13: f irmware m emory m ultiple d evice s election c onfiguration device # id[3:0] idsel 0 (boot device) 0000 0000 1 0001 0001 2 0010 0010 3 0011 0011 4 0100 0100 5 0101 0101 6 0110 0110 7 0111 0111 8 1000 1000 9 1001 1001 10 1010 1010 11 1011 1011 12 1100 1100 13 1101 1101 14 1110 1110 15 1111 1111 t13.0 1232 table 14: lpc m emory m ultiple d evice s election c onfiguration device # id[3:0] address range 1 1. for sst49lf002b, a 21 :a 18 , for sst49lf003b/004b, a 23 , a 21 :a 19 0 (boot device) 0000 1111 1 0001 1110 2 0010 1101 3 0011 1100 4 0100 1011 5 0101 1010 6 0110 1001 7 0111 1000 8 1000 0111 9 1001 0110 10 1010 0101 11 1011 0100 12 1100 0011 13 1101 0010 14 1110 0001 15 1111 0000 t14.0 1232
data sheet 2 mbit / 3 mbit / 4 mbit lpc firmware flash sst49lf002b / sst49lf003b / sst49lf004b 21 ?2005 silicon storage technology, inc. s71232-05-000 1/05 data# polling when the sst49lf00xb device is in the internal program operation, any attempt to r ead d[7] will produce the com- plement of the true data. once the program operation is completed, d[7] will produce true data. note that even though d[7] may have valid data immediately following the completion of an internal write operation, the remaining data outputs may still be in valid. valid data will appear on the entire data bus in subs equent successive read cycles after an interval of 1 s. during an internal erase operation, any attempt to read d[7] will produce a '0'. once the inter- nal erase operation is comple ted, d[7] will produce a '1'. proper status will not be given using data# polling if the address is in the invalid range. toggle bit during the internal program or erase operation, any consec- utive attempts to read d[6] will produce alternating 0s and 1s, i.e., toggling between 0 and 1. when the internal pro- gram or erase operation is completed, the toggling will stop. note that even though d[6] may have valid data immediately following the completion of an internal write operation, the remaining data outputs may still be invalid. valid data will appear on the entire data bus in subsequent successive read cycles after an interval of 1 s. proper status will not be given using toggle bit if the address is in the invalid range. registers there are three types of registers available on the sst49lf00xb, the general purpose inputs register, block locking registers, and the jedec id registers. these reg- isters appear at their respective address location in the 4 gbyte system memory map. unused register locations will read as 00h. any attempt to read or write any register dur- ing an internal write o peration will be ignored. general purpose inputs register the gpi_reg (general purpose inputs register) passes the state of gpi[4:0] to the outputs. it is recommended that the gpi[4:0] pins are in the desired state before lframe# is brought low for the beginning of the bus cycle, and remain in that state until the end of the cycle. there is no default value since this is a pass-through register. the gpi register for the boot device appears at ffbc0100h in the 4 gbyte system memory map, and will appear elsewhere if the device is not the boot device. the register is not available to be read when the device is in erase/program operation. block locking registers sst49lf00xb provides software controlled lock protection through a set of block locking registers. the block locking registers are read/write registers and are accessible through standard addressable memory locations specified in tables 15 through 17 for boot device. these registers will appear elsewhere if the device is not the boot device. unused register loca tions will read as 00h. write lock: the write-lock bit, bit 0, controls the lock state. the default write status of all blocks after power up is write locked. when bit 0 of the block locking register is set, program and erase operations for the corresponding block are prevented. clearing the writ e-lock bit will unprotect the block. the write-lock bit must be cleared prior to starting a program or erase operation since it is sampled at the beginning of the operation. the write-lock bit functions in conjunction with the hardware write lock pin tbl# for the top boot block. when tbl# is low, it overrides the software locking scheme. the top boot block locking register does not indicate the state of the tbl# pin. the write-lock bit functions in conjunction with the hardware wp# pin for blocks 0 to 6. when wp# is low, it overrides the software locking scheme. the block locking registers do not indi- cate the state of the wp# pin. lock down: the lock-down bit, bit 1, controls the block locking registers. the default lock down status of all blocks upon power-up is not locked down. once the lock-down bit is set, any future attempted changes to that block locking register will be ignored. the lock- down bit is only cleared upon a device reset with rst# or init# or power down. current lock down status of a par- ticular block can be determined by reading the corre- sponding lock-down bit.
22 data sheet 2 mbit / 3 mbit / 4 mbit lpc firmware flash sst49lf002b / sst49 lf003b / sst49lf004b ?2005 silicon storage technology, inc. s71232-05-000 1/05 jedec id registers the jedec id registers provide access to the manufac- turer and device id information with a single read cycle. the jedec id registers for the boot device appear at ffbc0000h and ffbc0001h in the 4 gbyte system memory map, and will appear el sewhere if the device is not the boot device. registers are not available for read when the device is in erase/program operation. refer to table 3 for product identification information. table 15: b lock l ocking r egisters for sst49lf002b 1 register block size protected memory address range memory map register address t_block_lk 16k 3ffffh - 3c000h ffbf8002h t_minus01_lk 16k 16k 16k 3bfffh - 38000h 37fffh - 34000h 33fffh - 30000h ffbf0002h t_minus02_lk 16k 16k 2ffffh - 2c000h 2bfffh - 28000h ffbe8002h t_minus03_lk 16k 16k 27fffh - 24000h 23fffh - 20000h ffbe0002h t_minus04_lk 16k 16k 1ffffh - 1c000h 1bfffh - 18000h ffbd8002h t_minus05_lk 16k 16k 17fffh - 14000h 13fffh - 10000h ffbd0002h t_minus06_lk 16k 16k 0ffffh - 0c000h 0bfffh - 08000h ffbc8002h t_minus07_lk 16k 16k 07fffh - 04000h 03fffh - 00000h ffbc0002h t15.0 1232 1. default value at power up is 01h table 16: b lock l ocking r egisters for sst49lf003b/004b 1 1. default value at power up is 01h register block size protected memory address range memory map register address sst49lf003b sst49lf004b t_block_lk 64k 07ffffh - 070000h 07ffffh - 070000h ffbf0002h t_minus01_lk 64k 06ffffh - 060000h 06ffffh - 060000h ffbe0002h t_minus02_lk 64k 05ffffh - 050000h 05ffffh - 050000h ffbd0002h t_minus03_lk 64k 04ffffh - 040000h 04ffffh - 040000h ffbc0002h t_minus04_lk 64k 03ffffh - 030000h 03ffffh - 030000h ffbb0002h t_minus05_lk 64k 02ffffh - 020000h 02ffffh - 020000h ffba0002h t_minus06_lk 64k 01ffffh - 010000h ffb90002h t_minus07_lk 64k 00ffffh - 000000h ffb80002h t16.0 1232 table 17: b lock l ocking r egister b its reserved bit [7..2] lock-down bit [1] write-lock bit [0] lock status 000000 0 0 full access 000000 0 1 write locked (default state at power-up) 000000 1 0 locked open (full access locked down) 000000 1 1 write locked down t17.0 1232
data sheet 2 mbit / 3 mbit / 4 mbit lpc firmware flash sst49lf002b / sst49lf003b / sst49lf004b 23 ?2005 silicon storage technology, inc. s71232-05-000 1/05 parallel programming mode device operation commands are used to initiate the memory operation func- tions of the device. the data portion of the software com- mand sequence is latched on the rising edge of we#. during the software command sequence the row address is latched on the falling edge of r/c# and the column address is latched on the rising edge of r/c#. read the read operation of the sst49lf00xb device is con- trolled by oe#. oe# is the output control and is used to gate data from the output pins. refer to the read cycle tim- ing diagram, figure 15, for further details. reset a v il on rst# pin initiates a device reset. byte-program operation the sst49lf00xb device is programmed on a byte-by- byte basis. before programming, one must ensure that the byte that is being programmed is fully erased. the byte- program operation is initiated by executing a four-byte com- mand load sequence for softwa re data protection with address (pa) and data in the last bus cycle. during the byte-program operation, the row address (a 10 -a 0 ) is latched on the falling edge of r/c# and the column address (a 21 -a 11 ) is latched on the rising edge of r/c#. the data bus is latched on the rising edge of we#. the program operation, once initia ted, will be completed, within 20 s. see figure 19 for timing waveforms. during the pro- gram operation, the only valid reads are data# polling and toggle bit. during the internal program operation, the host is free to perform additional tasks. any commands written during the internal program operation will be ignored. sector-erase operation the sector-erase operation allows the system to erase the device on a sector-by-sector basis. the sector architecture is based on uniform sector size of 4 kbyte. the sector- erase operation is initiated by executing a six-byte com- mand load sequence for softwa re data protection with sector-erase command (30h) and sector address (sa) in the last bus cycle. the internal erase operation begins after the sixth we# pulse. the end-of-erase can be determined using either data# polling or toggle bit methods. see fig- ure 20 for sector-erase timing waveforms. any commands written during the sector-era se operation will be ignored. block-erase operation the block-erase operation allows the system to erase the device in any of the 8 uniform 64 kbyte blocks for the sst49lf004b, 6 uniform 64 kbyte blocks for the sst49lf003b, and 8 uniform 16 kbyte blocks for the sst49lf002b. the block-erase operation is initiated by executing a six-byte command load sequence for software data protection with block-erase command (50h) and block address (ba) in the last bus cycle. the internal block- erase operation begins after the sixth we# pulse. the end-of-erase can be determined using either data# polling or toggle bit methods. see figure 21 for timing waveforms. any commands written during the block- erase operation will be ignored. chip-erase operation the sst49lf00xb device provides a chip-erase opera- tion only in pp mode, which allows the user to erase the entire memory array to the '1's state. this is useful when the entire device must be quickly erased. the chip-erase operation is initiated by executing a six- byte software data protection command sequence with chip- erase com- mand (10h) with address 5555h in the last bus cycle. the internal erase operation begins with the rising edge of the sixth we#. during the internal erase operation, the only valid reads are toggle bit or data# polling. see table 19 for the command sequence, figure 22 for timing diagram. any commands written during the chip-erase operation will be ignored. write operation status detection the sst49lf00xb device provides two software means to detect the completion of a write (program or erase) cycle, in order to optimize the system write cycle time. the soft- ware detection includes two status bits: data# polling (dq 7 ) and toggle bit (dq 6 ). the end-of-write detection mode is enabled after the rising edge of we# which ini- tiates the internal program or erase operation. the actual completion of the nonvolatile write is asynchro- nous with the system; therefore, either a data# polling or toggle bit read may be simultaneous with the completion of the write cycle. if this occurs, the system may possibly get an erroneous result, i.e., valid data may appear to conflict with either dq 7 or dq 6 . in order to prevent spurious rejec- tion, if an erroneous result occurs, the software routine should include a loop to read the accessed location an addi- tional two (2) times. if both reads are valid, the device has completed the write cycle, otherwise the rejection is valid.
24 data sheet 2 mbit / 3 mbit / 4 mbit lpc firmware flash sst49lf002b / sst49 lf003b / sst49lf004b ?2005 silicon storage technology, inc. s71232-05-000 1/05 data# polling (dq 7 ) when the sst49lf00xb device is in the internal program operation, any attempt to read dq 7 will produce the com- plement of the true data. once the program operation is completed, dq 7 will produce true data. note that even though dq 7 may have valid data immediately following the completion of an internal write operation, the remaining data outputs may still be in valid. valid data will appear on the entire data bus in subs equent successive read cycles after an interval of 1 s. during an internal erase operation, any attempt to read dq 7 will produce a '0'. once the inter- nal erase operation is completed, dq 7 will produce a '1'. data# polling is valid after the rising edge of the fourth we# pulse for the program operation. for sector-erase, block- erase, or chip-erase, the data# polling is valid after the ris- ing edge of the sixth we# pulse. see figure 17 for data# polling timing diagram. proper status will not be given using data# polling if the address is in the invalid range. toggle bit (dq 6 ) during the internal program or erase operation, any con- secutive attempts to read dq 6 will produce alternating '0's and '1's, i.e., toggling between 0 and 1. when the internal program or erase operation is completed, the toggling will stop. the device is then ready for the next operation. the toggle bit is valid after the rising edge of the fourth we# pulse for program operation. for sector-erase, block- erase or chip-erase, the toggle bit is valid after the rising edge of the sixth we# pulse. see figure 18 for toggle bit timing diagram. data protection (pp mode) the sst49lf00xb device provides both hardware and software features to protect nonvolatile data from inadvert- ent writes. hardware data protection noise/glitch protection : a we# pulse of less than 5 ns will not initiate a write cycle. v dd power up/down detection : the write operation is inhibited when v dd is less than 1.5v. write inhibit mode : forcing oe# low, we# high will inhibit the write operation. this prevents inadvertent writes during power-up or power-down. software data protection (sdp) the sst49lf00xb provides the jedec approved soft- ware data protection scheme for all data alteration opera- tion, i.e., program and erase. any program operation requires the inclusion of a series of three-byte sequence. the three-byte load sequence is used to initiate the pro- gram operation, providing optimal protection from inadvert- ent write operations, e.g., during the system power-up or power down. any erase operation requires the inclusion of a five-byte load sequence. table 18: o peration m odes s election (pp m ode ) mode rst# oe# we# dq address read v ih v il v ih d out a in program v ih v ih v il d in a in erase v ih v ih v il x 1 sector or block address, xxh for chip-erase reset v il x x high z x write inhibit v ih v il v ih high z/d out x product identification v ih v il v ih manufacturer?s id (bfh) device id 2 a ms 3 - a 1 = v il , a 0 = v il a ms - a 1 = v il , a 0 = v ih t18.1 1232 1. x can be v il or v ih , but no other value. 2. device id 57h for sst49lf002b, 1bh for sst49lf003b, and 60h for sst49lf004b 3. a ms = most significant address a ms = a 17 for sst49lf002b and a 18 for sst49lf003b/004b
data sheet 2 mbit / 3 mbit / 4 mbit lpc firmware flash sst49lf002b / sst49lf003b / sst49lf004b 25 ?2005 silicon storage technology, inc. s71232-05-000 1/05 software comm and sequence table 19: s oftware c ommand s equence command sequence 1st 1 cycle 1. lpc mode use consecutive write cycles to complete a command sequence; pp mode use consecut ive bus cycles to complete a command sequence. 2nd 1 cycle 3rd 1 cycle 4th 1 cycle 5th 1 cycle 6th 1 cycle addr 2 2. yyyy = a[31:16]. in lpc mode, during sdp command sequence, yyyy must be within valid memory address range, see address out of range section for details. in pp mode, yyyy can be v il or v ih , but no other value. data addr 2 data addr 2 data addr 2 data addr 2 data addr 2 data byte-program yyyy 5555h aah yyyy 2aaah 55h yyyy 5555h a0h pa 3 3. pa = program byte address data sector-erase yyyy 5555h aah yyyy 2aaah 55h yyyy 5555h 80h yyyy 5555h aah yyyy 2aaah 55h sa x 4 4. sa x for sector-erase address 30h block-erase yyyy 5555h aah yyyy 2aaah 55h yyyy 5555h 80h yyyy 5555h aah yyyy 2aaah 55h ba x 5 5. ba x for block-erase address 50h chip-erase 6 6. chip-erase is supported in pp mode only yyyy 5555h aah yyyy 2aaah 55h yyyy 5555h 80h yyyy 5555h aah yyyy 2aaah 55h yyyy 5555h 10h software id entry 7,8 7. sst manufacturer?s id = bfh, is read with a ms -a 0 = 0. a ms = most significant address a ms = a 17 for sst49lf002b and a 18 for sst49lf003b/004b with a 17 -a 1 = 0; 49lf002b device id = 57h, is read with a 0 = 1. with a 18 -a 1 = 0; 49lf003b device id = 1bh, is read with a 0 = 1. with a 18 -a 1 = 0; 49lf004b device id = 60h, is read with a 0 = 1. 8. the device does not remain in software product id mode if powered down. yyyy 5555h aah yyyy 2aaah 55h yyyy 5555h 90h read id software id exit 9 9. both software id exit operations are equivalent xxxx xxxxh f0h software id exit 9 yyyy 5555h aah yyyy 2aaah 55h yyyy 5555h f0h t19.1 1232
26 data sheet 2 mbit / 3 mbit / 4 mbit lpc firmware flash sst49lf002b / sst49 lf003b / sst49lf004b ?2005 silicon storage technology, inc. s71232-05-000 1/05 electrical specifications the ac and dc specifications for the lpc interface sign als (la0[3:0], lframe, lclck and rst#) are defined in sec- tion 4.2.2.4 of the pci local bus specification, rev. 2.1. refer to table 20 for the dc voltage and current specifications. refer to tables 24 through 30 for the ac timing specifications for clock, read, write, and reset operations. absolute maximum stress ratings (applied conditions greater than t hose listed under ?absolute maximum stress ratings? may cause permanent damage to the device. this is a stress rating only and functional operation of the device at these conditions or conditions greater t han those defined in the operational sections of this data sheet is not implied. exposu re to absolute maximum stress rating co nditions may affect device reliability.) temperature under bias . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55c to +125c storage temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -65c to +150c d.c. voltage on any pin to ground potential . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0 .5v to v dd +0.5v transient voltage (<20 ns) on any pin to ground potential 1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -2.0v to v dd +2.0v 1. do not violate processor or chip set limitations on the init# pin package power dissipation capability (t a =25c) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1.0w surface mount solder reflow temperature: . . . . . . . . . . . . . . . . . . . . . . . . . ?with-pb? units 2 : 240c for 3 seconds 2. certain ?with-pb? package types are capable of 260c for 3 se conds; please consult the factory for the latest information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ?non -pb? units: 260c for 3 seconds output short circuit current 3 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 ma 3. outputs shorted for no more than one second. no more than one output shorted at a time. o perating r ange range ambient temp v dd commercial 0c to +85c 3.0-3.6v ac c onditions of t est 1 1. lpc interface signals use pci load test condition input rise/fall time . . . . . . . . . . . . . . . 3 ns output load . . . . . . . . . . . . . . . . . . . . . c l = 30 pf see figures 25 and 26
data sheet 2 mbit / 3 mbit / 4 mbit lpc firmware flash sst49lf002b / sst49lf003b / sst49lf004b 27 ?2005 silicon storage technology, inc. s71232-05-000 1/05 dc characteristics table 20: dc o perating c haracteristics (a ll i nterfaces ) symbol parameter limits test conditions min max units i dd 1 1. i dd active while a read or write (program or erase) operation is in progress. active v dd current lclk (lpc mode) and address input (pp mode) =v ilt /v iht at f=33 mhz ( lpc mode ) or 1/ trc min ( pp mode ) all other inputs=v il or v ih read 12 ma all outputs = open, v dd =v dd max write 2 2. for pp mode: oe# = we# = v ih ; for lpc mode: f = 1/t rc min, lframe# = v ih . 30 ma see note 2 i sb standby v dd current (lpc interface) 100 a lclk (lpc mode) and address input (pp mode) =v ilt /v iht at f=33 mhz ( lpc mode ) or 1/ trc min ( pp mode ) lframe#=0.9 v dd , f=33 mhz, ce#=0.9 v dd , v dd =v dd max, all other inputs 0.9 v dd or 0.1 v dd i ry 3 3. the device is in ready mode w hen no activity is on the lpc bus. input current for mode and id[3:0] pins 10 ma lclk (lpc mode) and address input (pp mode) =v ilt /v iht at f=33 mhz ( lpc mode ) or 1/ trc min ( pp mode ) lframe#=v il , f=33 mhz, v dd =v dd max all other inputs 0.9 v dd or 0.1 v dd i i input leakage current for mode and id[3:0] pins 200 a v in =gnd to v dd , v dd =v dd max i li input leakage current 1 a v in =gnd to v dd , v dd =v dd max i lo output leakage current 1 a v out =gnd to v dd , v dd =v dd max v ihi init# input high voltage 1.1 v dd +0.5 v v dd =v dd max v ili init# input low voltage -0.5 0.4 v v dd =v dd min v il input low voltage -0.5 0.3 v dd vv dd =v dd min v ih input high voltage 0.5 v dd v dd +0.5 v v dd =v dd max v ol output low voltage 0.1 v dd v v oh output high voltage 0.9 v dd v t20.2 1232 table 21: r ecommended s ystem p ower - up t imings symbol parameter minimum units t pu-read 1 1. this parameter is measured only for init ial qualification and after a design or proc ess change that could affect this paramet er power-up to read operation 100 s t pu-write 1 power-up to write operation 100 s t21.0 1232 table 22: p in c apacitance (v dd =3.3v, t a =25 c, f=1 mhz, other pins open) parameter description test condition maximum c i/o 1 1. this parameter is measured only for init ial qualification and after a design or proc ess change that could affect this paramet er. i/o pin capacitance v i/o =0v 12 pf c in 1 input capacitance v in =0v 12 pf t22.0 1232
28 data sheet 2 mbit / 3 mbit / 4 mbit lpc firmware flash sst49lf002b / sst49 lf003b / sst49lf004b ?2005 silicon storage technology, inc. s71232-05-000 1/05 figure 10: lclk w aveform (lpc m ode ) table 23: r eliability c haracteristics symbol parameter minimum spec ification units test method n end 1 endurance 10,000 cycles jedec standard a117 t dr 1 data retention 100 years jedec standard a103 i lt h 1 latch up 100 + i dd ma jedec standard 78 t23.0 1232 1. this parameter is measured only for init ial qualification and after a design or proc ess change that could affect this paramet er. table 24: c lock t iming p arameters (lpc m ode ) symbol parameter min max units t cyc lclk cycle time 30 ns t high lclk high time 11 ns t low lclk low time 11 ns - lclk slew rate (peak-to-peak) 1 4 v/ns - rst# or init# slew rate 50 mv/ns t24.0 1232 1232 f07.0 0.4 v dd p-to -p (minimum) t cyc t high t low 0.4 v dd 0 .3 v dd 0.6 v dd 0.2 v dd 0.5 v dd
data sheet 2 mbit / 3 mbit / 4 mbit lpc firmware flash sst49lf002b / sst49lf003b / sst49lf004b 29 ?2005 silicon storage technology, inc. s71232-05-000 1/05 ac characteristics (lpc mode) table 25: r ead /w rite c ycle t iming p arameters , v dd =3.0-3.6v (lpc m ode ) symbol parameter min max units t cyc clock cycle time 30 ns t su data set up time to clock rising 7 ns t dh clock rising to data hold time 0 ns t val 1 1. minimum and maximum times have different loads. see pci spec clock rising to data valid 2 11 ns t bp byte programming time 20 s t se sector-erase time 25 ms t be block-erase time 25 ms t on clock rising to active (float to active delay) 2 ns t off clock rising to inactive (active to float delay) 28 ns t25.0 1232 table 26: ac i nput /o utput s pecifications (lpc m ode ) symbol parameter min max units conditions i oh (ac) switching current high -12 v dd -17.1(v dd -v out ) equation c 1 1. see pci spec. ma ma 0 < v out 0.3v dd 0.3v dd < v out < 0.9v dd 0.7v dd < v out < v dd (test point) -32 v dd ma v out = 0.7v dd i ol (ac) switching current low 16 v dd 26.7 v out equation d 1 ma ma v dd >v out 0.6v dd 0.6v dd > v out > 0.1v dd 0.18v dd > v out > 0 (test point) 38 v dd ma v out = 0.18v dd i cl low clamp current -25+(v in +1)/0.015 ma -3 < v in -1 i ch high clamp current 25+(v in -v dd -1)/0.015 ma v dd +4 > v in v dd +1 slewr output rise slew rate 1 4 v/ns 0.2v dd -0.6v dd load slewf output fall slew rate 1 4 v/ns 0.6v dd -0.2v dd load t26.0 1232
30 data sheet 2 mbit / 3 mbit / 4 mbit lpc firmware flash sst49lf002b / sst49 lf003b / sst49lf004b ?2005 silicon storage technology, inc. s71232-05-000 1/05 figure 11: o utput t iming p arameters (lpc m ode ) figure 12: i nput t iming p arameters (lpc m ode ) t val t off t on 1232 f09.0 lclk lad [3:0] ( valid output data) lad [3:0] ( float output data) v test v t l v t h t su t dh inputs valid 1232 f10.0 lclk lad [3:0] ( valid input data) v test v t l v max v t h
data sheet 2 mbit / 3 mbit / 4 mbit lpc firmware flash sst49lf002b / sst49lf003b / sst49lf004b 31 ?2005 silicon storage technology, inc. s71232-05-000 1/05 figure 13: r eset t iming d iagram (lpc m ode ) table 27: i nterface m easurement c ondition p arameters (lpc m ode ) symbol value units v th 1 0.6 v dd v v tl 1 0.2 v dd v v test 0.4 v dd v v max 1 0.4 v dd v input signal edge rate 1 v/ns t27.0 1232 1. the input test environment is done with 0.1 v dd of overdrive over v ih and v il . timing parameters must be met with no more over- drive than this. v max specifies the maximum peak-to-peak waveform allowed for measuring input timing. production testing may use different voltage values, but must correlate results back to these parameters. table 28: r eset t iming p arameters , v dd =3.0-3.6v (lpc m ode ) symbol parameter min max units t prst v dd stable to reset high 100 s t rstp rst# pulse width 100 ns t rstf rst# low to output float 48 ns t rst 1 1. there will be a latency due to t rste if a reset procedure is performed during a program or erase operation, rst# high to lframe# low 5 lclk cycles t rste rst# low to reset during sector-/block-erase or program 10 s t28.0 1232 v dd r st#/init# lframe# lad[3:0] 1232 f08.1 t prst t rstp t rstf t rste sector-/block-erase or program operatio n aborted t rst
32 data sheet 2 mbit / 3 mbit / 4 mbit lpc firmware flash sst49lf002b / sst49 lf003b / sst49lf004b ?2005 silicon storage technology, inc. s71232-05-000 1/05 figure 14: r eset t iming d iagram (pp m ode ) table 29: r eset t iming p arameters , v dd =3.0-3.6v (pp m ode ) symbol parameter min max units t prst v dd stable to reset low 1 ms t rstp rst# pulse width 100 ns t rstf rst# low to output float 48 ns t rst 1 rst# high to row address setup 1 s t rste rst# low to reset during sector-/block-erase or program 10 s t rstc rst# low to reset during chip-erase 50 s t29.0 1232 1. there will be a reset latency of t rste or t rstc if a reset procedure is performed duri ng a programming or erase operational. v dd rst# a ddresses r/c# dq 7-0 1232 f11.0 t prst t rstp t rstf t rste row address sector-/block-erase or program operation aborted t rst t rstc chip-erase aborted
data sheet 2 mbit / 3 mbit / 4 mbit lpc firmware flash sst49lf002b / sst49lf003b / sst49lf004b 33 ?2005 silicon storage technology, inc. s71232-05-000 1/05 ac characteristics (pp mode) table 30: r ead c ycle t iming p arameters , v dd =3.0-3.6v (pp m ode ) symbol parameter min max units t rc read cycle time 270 ns t rst rst# high to row address setup 1 s t as r/c# address set-up time 45 ns t ah r/c# address hold time 45 ns t aa address access time 120 ns t oe output enable access time 60 ns t olz oe# low to active output 0 ns t ohz oe# high to high-z output 35 ns t oh output hold from address change 0 ns t30.0 1232 table 31: p rogram /e rase c ycle t iming p arameters , v dd =3.0-3.6v (pp m ode ) symbol parameter min max units t rst rst# high to row address setup 1 s t as r/c# address setup time 45 ns t ah r/c# address hold time 45 ns t cwh r/c# to write enable high time 50 ns t oes oe# high setup time 20 ns t oeh oe# high hold time 20 ns t oep oe# to data# polling delay 60 ns t oet oe# to toggle bit delay 60 ns t wp we# pulse width 100 ns t wph we# pulse width high 100 ns t ds data setup time 50 ns t dh data hold time 5 ns t ida software id access and exit time 150 ns t bp byte programming time 20 s t se sector-erase time 25 ms t be block-erase time 25 ms t sce chip-erase time 100 ms t31.0 1232
34 data sheet 2 mbit / 3 mbit / 4 mbit lpc firmware flash sst49lf002b / sst49 lf003b / sst49lf004b ?2005 silicon storage technology, inc. s71232-05-000 1/05 figure 15: r ead c ycle t iming d iagram (pp m ode ) figure 16: w rite c ycle t iming d iagram (pp m ode ) rst# t rst 1232 f12.0 column address data valid high-z row address column address row address a ddresses r/c# v ih high-z t rc t as t ah t ah t aa t oe t olz t ohz t oh t as we# oe# dq 7-0 1232 f13.0 column address row address data valid rst# a ddresses r/c# t rst t as t ah t cwh t wp t oes t wph t oeh t dh t ds t ah t as we# oe# dq 7-0
data sheet 2 mbit / 3 mbit / 4 mbit lpc firmware flash sst49lf002b / sst49lf003b / sst49lf004b 35 ?2005 silicon storage technology, inc. s71232-05-000 1/05 figure 17: d ata # p olling t iming d iagram (pp m ode ) figure 18: t oggle b it t iming d iagram (pp m ode ) 1232 f15.0 a ddresses r/c# t oep row column we# oe# dq 7 d# d d# d 1232 f15.0 a ddresses r/c# t oet row column we# oe# dq 6 d d
36 data sheet 2 mbit / 3 mbit / 4 mbit lpc firmware flash sst49lf002b / sst49 lf003b / sst49lf004b ?2005 silicon storage technology, inc. s71232-05-000 1/05 figure 19: b yte -p rogram t iming d iagram (pp m ode ) figure 20: s ector -e rase t iming d iagram (pp m ode ) 5555 5555 2aaa a 14-0 r/c# oe# we# d q 7-0 ba internal program star ts aa 55 a0 data ba = byte-program address 1232 f16.1 5555 5555 5555 2aaa sa x 2aaa a 14-0 r/c# oe# we# d q 7-0 internal erase starts aa 55 80 aa 55 30 sa x = sector address 1232 f17.1
data sheet 2 mbit / 3 mbit / 4 mbit lpc firmware flash sst49lf002b / sst49lf003b / sst49lf004b 37 ?2005 silicon storage technology, inc. s71232-05-000 1/05 figure 21: b lock -e rase t iming d iagram (pp m ode ) figure 22: c hip -e rase t iming d iagram (pp m ode ) 5555 5555 5555 2aaa ba x 2aaa a 14-0 r/c# oe# we# d q 7-0 internal erase starts aa 55 80 aa 55 50 ba x = block address 1232 f18.1 5555 5555 5555 2aaa 5555 2aaa a 14-0 r/c# oe# we# d q 7-0 internal erase starts aa 55 80 aa 55 10 1232 f19.1
38 data sheet 2 mbit / 3 mbit / 4 mbit lpc firmware flash sst49lf002b / sst49 lf003b / sst49lf004b ?2005 silicon storage technology, inc. s71232-05-000 1/05 figure 23: s oftware id e ntry and r ead (pp m ode ) figure 24: s oftware id e xit (pp m ode ) 5555 5555 0000 0001 2aaa a 14-0 r/c# oe# we# d q 7-0 aa 1232 f20.1 device id bf 55 90 t wp t wph t ida t aa three-byte sequence for software id entry device id = 57h for sst49lf002b, 1bh for sst49lf003b, 60h for sst49lf004b 5555 5555 2aaa a 14-0 r/c# oe# we# d q 7-0 aa 1232 f21.1 55 f0 t ida
data sheet 2 mbit / 3 mbit / 4 mbit lpc firmware flash sst49lf002b / sst49lf003b / sst49lf004b 39 ?2005 silicon storage technology, inc. s71232-05-000 1/05 figure 25: ac i nput /o utput r eference w aveforms figure 26: a t est l oad e xample 1232 f22.0 reference points output input v it v iht v ilt v ot ac test inputs are driven at v iht (0.9 v dd ) for a logic ?1? and v ilt (0.1 v dd ) for a logic ?0?. measurement reference points for inputs and outputs are v it (0.5 v dd ) and v ot (0.5 v dd ). input rise and fall times (10% ? 90%) are <5 ns. note: v it - v input te s t v ot - v output te s t v iht - v input high test v ilt - v input low test 1232 f23.0 to tester t o dut c l
40 data sheet 2 mbit / 3 mbit / 4 mbit lpc firmware flash sst49lf002b / sst49 lf003b / sst49lf004b ?2005 silicon storage technology, inc. s71232-05-000 1/05 product ordering information valid combinations for sst49lf002b sst49lf002b-33-4c-nh SST49LF002B-33-4C-NHE valid combinations for sst49lf003b sst49lf003b-33-4c-nh sst49lf003b-33-4c-nhe valid combinations for sst49lf004b sst49lf004b-33-4c-ei sst49lf004b-33-4c-nh sst49lf004b-33-4c-eie sst49lf004b-33-4c-nhe note: valid combinations are those products in mass producti on or will be in mass production. consult your sst sales representative to confirm availability of valid combinat ions and to determine availability of new combinations. environmental attribute e 1 = non-pb package modifier h = 32 leads i = 40 leads package type n = plcc e = tsop (type 1, die up, 10mm x 20mm ) operating temperature c = commercial = 0c to +85c minimum endurance 4 = 10,000 cycles serial access clock frequency 33 = 33 mhz device density 004 = 4 mbit 003 = 3 mbit 002 = 2 mbit voltage range l = 3.0-3.6v product series 49 = lpc firmware memories 1. environmental suffix ?e? denotes non-pb solder. sst non-pb solder devices are ?rohs compliant?. device speed suffix1 suffix2 sst49 l f00x b- xxx -x x -x x x
data sheet 2 mbit / 3 mbit / 4 mbit lpc firmware flash sst49lf002b / sst49lf003b / sst49lf004b 41 ?2005 silicon storage technology, inc. s71232-05-000 1/05 packaging diagrams 32- lead p lastic l ead c hip c arrier (plcc) sst p ackage c ode : nh .040 .030 .021 .013 .530 .490 .095 .075 .140 .125 .032 .026 .032 .026 .029 .023 .453 .447 .553 .547 .595 .585 .495 .485 .112 .106 .042 .048 .048 .042 .015 min. top view side view bottom view 1 232 .400 bsc 32-plcc-nh- 3 n ote: 1. complies with jedec publication 95 ms-016 ae dimensions, although some dimensions may be more stringent. 2. all linear dimensions are in inches (max/min). 3. dimensions do not include mold flash. maximum allowable mold flash is .008 inches. 4. coplanarity: 4 mils. .050 bsc .050 bsc optional pin #1 i dentifier .020 r. max. r. x 30?
42 data sheet 2 mbit / 3 mbit / 4 mbit lpc firmware flash sst49lf002b / sst49 lf003b / sst49lf004b ?2005 silicon storage technology, inc. s71232-05-000 1/05 40- lead t hin s mall o utline p ackage (tsop) 10 mm x 20 mm sst p ackage c ode : ei 18.50 18.30 20.20 19.80 0.70 0.50 10.10 9.90 0.27 0.17 1.05 0.95 0.15 0.05 0.70 0.50 40-tsop-ei-7 n ote: 1. complies with jedec publication 95 mo-142 cd dimensions, although some dimensions may be more stringent. 2. all linear dimensions are in millimeters (max/min). 3. coplanarity: 0.1 mm 4. maximum allowable mold flash is 0.15 mm at the package ends, and 0.25 mm between leads. pin # 1 identifier 0.50 bsc 1.20 max. 0?- 5? detail 1mm
data sheet 2 mbit / 3 mbit / 4 mbit lpc firmware flash sst49lf002b / sst49lf003b / sst49lf004b 43 ?2005 silicon storage technology, inc. s71232-05-000 1/05 table 32: r evision h istory number description date 00 initial release jan 2003 01 added a footnote to table 3 on page 12 removed the ce# signal from figures 8 and 9 changes to table 20 on page 27 ? changed v ihi values ? updated the i dd test conditions jun 2003 02 2004 data book updated status to ?data sheet? dec 2003 03 added 2 mbit and 3 mbit devices added 32-tsop (wh/whe) package for 4 mbit devices clarified the solder temperature profile under ?absolute maximum stress ratings? on page 26 sep 2004 04 removed 32-tsop (wh/whe) package and mpns for 4 mbit devices sep 2004 05 added 32-plcc (nhe) package for 2 mbit devices added rohs compliance information on page 1 and in the ?product ordering infor- mation? on page 40 jan 2005 silicon storage technology, inc. 1171 sonora court sunnyvale, ca 94086 telephone 408-735-9110 fax 408-735-9036 www.superflash.com or www.sst.com

▲Up To Search▲

Price & Availability of SST49LF002B-33-4C-NHE

	To Download SST49LF002B-33-4C-NHE Datasheet File
If you can't view the Datasheet, Please click here to try to view without PDF Reader .